Micron collaborates with NVIDIA to deliver high-performance memory products for chips like HGX B300 NVL16 and GB300 NVL72.
Micron Delivers its Most Powerful Memory Products; Announces 12H HBM3E and SOCAMM Memory to Enhance Performance and Efficiency of AI Platforms
Leading memory manufacturers like Micron, SK Hynix, and Samsung have been delivering their most powerful memory products for powerful chips like NVIDIA's Blackwell data center GPUs. With SK Hynix introducing its HBM3E and SOCAMM memory products, Micron has also announced 12-High HBM3E and LPDDR5X-based SOCAMM memories at the GTC 2025 event.
While SK Hynix remained a key supplier of HBM3 memory chips to NVIDIA previously, Micron has also partnered with NVIDIA to deliver its 12-High HBM3E and SOCAMM memories for high-performance chips. The LPDDR5X SOCAMM (small outline compression attached memory module) from Micron will be used on NVIDIA's GB300 Grace Blackwell Ultra Superchip while its HBM3E 12H 36 GB memory will be utilized on the HGX B300 NVL16 and GB300 NVL72 platforms.
These are the latest and most powerful Blackwell chips unveiled by NVIDIA at the GTC event, but Micron is also supplying HBM3E 8-High 24 GB chips to NVIDIA for the HGX B200 and GB200 NVL72 platforms. The 12-High HBM3E memory has 12 DRAM dies stacked vertically, achieving 12 GB higher memory capacity than the 8-High variant. Since AI workloads are memory-intensive, 36 GB memory chips will drastically increase the memory capacity on NVIDIA GPUs.
Compared to 8-High HBM3E stacks, the total memory capacity increases by 50% with the 12-H HBM3E memory. This allows Blackwell Ultra GPU to run larger models and the Meta Llama 405B can now fit on a single GPU. The new HBM3E memory will not only have higher memory capacity and memory bandwidth but will also consume 20% less power, making it ideal for data centers.
The LPDDR5X-based SOCAMM is an excellent option for HPC as well. It measures just 14x90mm, taking almost 1/3rd the space of RDIMMs and can offer up to 128 GB per module by utilizing 16-die stacks of LPDDR5X memory. The SOCAMM is significantly more power-efficient than regular RDIMMs and delivers over 2.5X the bandwidth.
At the moment, Micron has a powerful portfolio consisting of GDDR7 memory (used on NVIDIA Blackwell RTX 50 series GPUs), high-capacity DDR5 RDIMMs and MRDIMMs, HBM3E and SOCAMM, as well as the industry's leading storage solutions such as the Micron 9550 NVMe and 7450 NVMe SSDs. Samsung has also released its flagship 9100 PRO SSD with PCI-E 5.0 standard, delivering up to 14,800 MB/s of sequential Read speeds.
