MSI MAG X870E Edge TI WIFI, X870E Tomahawk WIFI & X870 Tomahawk Motherboards Review – Great Designs For New Ryzen Builders

CPU Power Consumption Tests

The AMD Ryzen 9000 CPUs come in the same two or three chiplet configurations as the Ryzen 7000 series with one or two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 4nm process node. Then we have the larger die around the center, the IOD, based on a 6nm process node. The AMD Ryzen 9000 CCD measures a die size of 70.6mm2 and features a total of 8.6 Billion transistors per CCD. The IOD has a die size of 122m2 and features 3.4 billion transistors.

Scattered around the package are several SMDs (capacitors/resistors) that usually sit under the package substrate if we consider Intel's CPUs. AMD is instead featuring them on the top layer and as such, they had to design a new kind of IHS which is internally referred to as the Octopus.