The trial production phase, where TSMC reportedly achieved a milestone of 60 percent yields, can shift to full-scale manufacturing soon as the Taiwanese foundry behemoth continues to progress in improving throughput to meet demand for clients that want next-generation chips in a multitude of applications. Sources familiar with the matter have stated that there is a possibility that the firm will reach 50,000 monthly wafers, with a scenario that this figure also reaches 80,000 units by the end of 2025.
One of TSMC’s plants in Taiwan can reach a production output of 25,000 monthly wafers, but rumors claim that the company is still finding a way out of the trial production phase
There are currently two facilities in Taiwan that are focused on 2nm production; Baoshan and Kaohsiung. During the trial production, TSMC was reported to have an initial wafer production target of 5,000 at its Kaohsiung plant, with the same output targeted at its Baoshan site too. Now, details published on Economic Daily News that were spotted by tipster @Jukanlosreve mention that at the current progress level, TSMC has the capability to reach 50,000 monthly wafers by the end of the year.
However, if there are no snags in the production run, that figure is more than capable of touching 80,000 units. Sadly, no confirmation has been made by TSMC, with the foundry behemoth only commenting that it is making progress in this area. Industry sources close to the company’s plan mentioned that Baoshan plant has the capacity to reach 25,000 monthly wafers, which only means that the remaining 25,000 units will be mass produced by the Kaohsiung facility.
Given the skyrocketing demand for 2nm chips, which are said to be higher than 3nm, it is only in TSMC’s best interest that it scales production to an acceptable figure. At the time of writing, the company is doing significantly better than Samsung, which has only managed a 30 percent yield on its 2nm GAA technology during the trial production phase of the Exynos 2600.
News Source: Economic Daily News
